Ovonyx

Ovonyx Thin-film Device and Materials Development Services Now Available to Outside Customers

Ovonyx provides a quick turn, full range of thin-film device and materials development services including device prototyping, electrical testing, alternative materials deposition, and failure analysis
Services include - Process Facility Overview (PPT, 1.3Meg):
  • PVD deposition
    • Batch and cluster
    • Multi target
    • Co-sputtering
  • PECVD deposition
    • SiO2, Si3N4
  • Dry Etching
    • RIE, Plasma, Ash, RPC
    • Chlorine/Fluorine chemistries
  • Wet Etching
  • Lithography
    • Ebeam - 50nM
    • Contact print – 700 nM
  • Anneals – RTA and oven
  • Metrology
  • Failure Analysis (PPT, 3.7Meg)
    • Dual Beam FEI Nova Nano Lab 600i tool
    • High-resolution Scanning Electron Microscope (SEM)
    • Focused Ion Beam (FIB)
    • Elemental Analysis: EDX and WDS
    • 30kV Scanning Transmission Electron Microscope (STEM)
    • TEM prep
  • Materials preparation (PPT, .13Meg)
    • Sputtering targets
    • Target bonding
    • Evaporation materials
  • DC/Fast-pulse Electrical testing
  • Mechanical Thin Film testing
Tools Composite

Contact:
services@ovonyx.com
(248) 293-0440, x6168